CuSO4电镀工艺,CuSO4 electroplating process
1)CuSO4 electroplating processCuSO4电镀工艺
1.This paper describes the development and characteristic ofCuSO4 electroplating process "Cu-BRITE TFⅡ" ,it is suitable for via filling and through holoe filling using electroplating copper plating.概述了CuSO4电镀工艺"CU-BRITE TFⅡ"的开发和特性,适用于镀铜层填充导通孔和贯通孔。
2)Cupric salfate production engineeringCuSO4生产工艺
3)plating process电镀工艺
1.An electroplating process of Ag-Ni alloy for production of electrical contact materials was presented.介绍了用于生产电接触材料的银镍合金电镀工艺。
英文短句/例句
1.electrochemical etching and replating process电化腐蚀和电镀工艺
2.Study on Iron Electroplating and Fe-SiC Composite Electroplating Technics;电镀铁及Fe-SiC复合电镀工艺的研究
3.Micro-via Filling and Through Hole Plating in one Process in Vertical Line垂直电镀线盲孔和通孔同步电镀工艺
4.Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”
5.Optimization and structural characterization of Ni-SiC composite electroplatingNi-SiC复合电镀工艺的优化及镀层结构表征
6.Study on Process of Fe-Cr-Ni Eelectroplated Coating and Electrochemical Corrosion PerformanceFe-Cr-Ni电镀工艺和电化学腐蚀研究
7.Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
8.Study on the Technology of Bright Copper Plating in Acidic Copper Sulphate Solution With Additive Agent“153”“153”酸性硫酸铜光亮电镀工艺的研究
9.Cr~(+8) Electroplating Process With formate and Acetate System甲酸盐——乙酸盐体系三价铬电镀工艺
10.A Study on Process and Fundamentals of Zn-Mn Alloy Electrodeposition;Zn-Mn合金电镀工艺及其基础理论研究
11.Study of Ni-SiC Nano-Composite Plating Process;Ni-SiC纳米复合电镀工艺的研究
12.Study on the Composite Plating Technology of Fixed Diamond Wire;固结金刚石线锯的复合电镀工艺研究
13.Study on the Composite Electroplating of Ni/nano-Al_2O_3 Particles;Ni/纳米Al_2O_3复合电镀工艺的研究
14.A Study on Composite Plating of Ni-SiC on ABS Plastics;ABS塑料上Ni-SiC复合电镀工艺研究
15.In modern operations tin is generally deposited on the steel plate by electrolytic action.要现代工艺中，一般是用电镀法将锡镀在钢片上。
16.Researches on Processes of Electroplating Zinc and Cu/Ni/Cr on AZ91D Magnesium Alloy;AZ91D镁合金电镀锌及铜/镍/铬组合镀层工艺研究
17.Study on the Technics and Corrosion Performances of Brush-Plated SiC/Ni-P Composite Coatings;电刷镀SiC/Ni-P复合镀层工艺及腐蚀性能研究
18.The Pulse Electronics Brush Plates the Repair Rolling Mill Tooth Wheel Axle to Brush Plates the Craft Practice脉冲电刷镀修复轧机齿轮轴刷镀工艺实践
相关短句/例句
Cupric salfate production engineeringCuSO4生产工艺
3)plating process电镀工艺
1.An electroplating process of Ag-Ni alloy for production of electrical contact materials was presented.介绍了用于生产电接触材料的银镍合金电镀工艺。
4)electroplating technology电镀工艺
1.Preliminary study onelectroplating technology of automotive aluminum hubs(I);汽车铝轮毂电镀工艺初探(一)
2.Preliminary study onelectroplating technology of automotive aluminum hubs (Ⅱ );汽车铝轮毂电镀工艺初探(二)
3.Theelectroplating technology is the major factor which influences the electroplating quality.电镀磨料法是制造超硬磨料工具的常用方法,电镀质量直接影响到电镀超硬磨料工具的寿命和使用性能,而电镀工艺是影响电镀质量的主要因素。
5)electroplating process电镀工艺
1.Control system forelectroplating process based on power source;基于电源装备的电镀工艺过程控制系统
6)zinc electroplating process电镀锌工艺
延伸阅读
Cu铜元素中文名:铜原子量：55.847熔点：1083c 原子序数：29元素英文名: copper 价电子：3d10沸点：2567c核外电子排布:2,8,18,1元素符号： cu 英文名： copper 中文名： 铜相对原子质量： 63.55 常见化合价： +1,+2 电负性： 1.9外围电子排布： 3d10 4s1 核外电子排布： 2,8,18,1同位素及放射线：cu-61[3.4h] cu-62[9.7m] *cu-63 cu-64[12.7h] cu-65 cu-67[2.6d]电子亲合和能： 118.3 kj·mol-1第一电离能： 745 kj·mol-1 第二电离能： 1958 kj·mol-1 第三电离能： 3555 kj·mol-1单质密度： 8.96 g/cm3 单质熔点： 1083.0 ℃ 单质沸点： 2567.0 ℃原子半径： 1.57 埃 离子半径： 0.73(+2) 埃 共价半径： 1.17 埃常见化合物： cuo cu2o cu2s cucl2 cu(oh)2 cuso4 cufes2 [cu(nh3)2]oh cuf2 cubr2发现人： 远古就被发现 时间： 0 地点： 未知名称由来：元素符号来自拉丁文“cuprum”（以铜矿著称的塞浦路斯岛）。元素描述：柔韧有延展性的红棕色金属。元素来源：自然界很少存在铜单质。铜元素通常只见于硫化物如黄铜矿(cufes2)、coveline(cus)、辉铜矿，或者氧化物如赤铜矿中。元素用途：主要用作导体，也用于制造水管。铜合金可用作首饰和钱币的材料。网络用语:see you，再见
