电镀铜,copper electroplating
1)copper electroplating电镀铜
1.Effect of pyrophosphate quality oncopper electroplating不同品质的焦磷酸盐对电镀铜的影响
2.The composite coating was prepared on an aluminum alloy by anodizing,copper electroplating and chemical plating Ni-P.先将铝合金样品阳极氧化30 min,然后电镀铜5 min,最后化学镀镍30 min,可以在铝合金表面获得颜色稳定、结合性能良好的复合层,且复合层致密,厚度可达20μm以上,复合层的硬度HV0。
3.A new method forcopper electroplating was established by introducing alternating current overlapped with direct current to replace conventional direct current power source,aiming at increasing the current efficiency and breakthrough the bottleneck of limit current density.在原直流电镀铜工艺的基础上,将直流电源改为交直流叠加电源进行电镀,建立了一种电镀铜的新办法,以求突破极限电流密度的限制,提高电镀效率。
英文短句/例句
1.Synthesis and Electrochemical Properties of a Copper Plating Additive电镀铜添加剂的合成及其电化学性能
2.Study of Vertical-Structured GaN-Based LED by Electroplating Copper Layer;GaN基垂直结构LED电镀铜衬底的研究
3.Effect of pyrophosphate quality on copper electroplating不同品质的焦磷酸盐对电镀铜的影响
4.Copper Plating Process for Printed Circuit Board and Disposal of Common ProblemsPCB电镀铜工艺和常见问题的处理
5.Research on acidic copper additives used in through-hole plating of PCB manufacture印制电路板中通孔电镀铜添加剂的研究
6.To coat or finish with a layer of copper.镀铜于给…包铜或镀铜
7.The assembly shall have a electroless nickel-plated tubular copper body.这种总成应该具有非电镀镀镍层管状铜阀体。
8.Researches on Processes of Electroplating Zinc and Cu/Ni/Cr on AZ91D Magnesium Alloy;AZ91D镁合金电镀锌及铜/镍/铬组合镀层工艺研究
9.Electrochemical behavior of copper deposit on iron electrode in HEDP bath铁电极上HEDP镀铜的电化学行为
10.Study on Treatment of Electroplating Waste-water with Immobilized SRB硫酸盐还原菌(SRB)固定化技术处理镀铜、镀铁混合电镀废水的研究
11.RECOVERY OF Cu FROM ACIDIC COPPER RINSE WATER槽边循环电解法从酸性镀铜废水中回收铜
12.High Speed Acidic Electroplating Technology of Compact and Bright Sn and Sn-Cu Alloy for Copper Wire铜线材酸性高速电镀致密光亮锡、锡铜合金
13.Hot Tinning Process of Copper-constantan Thermocouples and Thermometric Characteristics Analysis铜-康铜热电偶的热镀锡膜工艺和测温特性分析
14.Metallic coatings-Electroplated coatings of copper for engineering purposesGB/T12333-1990金属覆盖层工程用铜电镀层
15.Study on the Technology of Bright Copper Plating in Acidic Copper Sulphate Solution With Additive Agent“153”“153”酸性硫酸铜光亮电镀工艺的研究
16.Automatic Potential Titration Analysis on Bright Acid Electroplating Copper Bath自动电位滴定分析光亮酸性镀铜溶液
17.Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;无氰电镀22K金—铜合金工艺研究
18.The study of electrochemical behaviors for a citrate alkaline copper plating bath柠檬酸盐碱性镀铜的电化学行为研究
相关短句/例句
copper plating电镀铜
1.Applications ofcopper plating technology to electronic materials;电镀铜技术在电子材料中的应用
2.As a result,Poly(N-vinyl-N′-butylimidazoliniumbromize) may be a kind of perfect additive applied incopper plating of printed circuit board.采用阴极极化曲线、交流阻抗谱测试其电化学性能,并将该物质作为电镀铜添加剂。
3)brass plating电镀黄铜
1.The work principle of thebrass plating technology with single wire control of the CPA Co.介绍传统的钢帘线钢丝镀层工艺并分析存在的问题,说明CPA单丝控制电镀黄铜技术的工作原理,对新技术与传统技术生产效果进行比较,结果显示:使用新技术可将黄铜中铜质量分数的波动范围由±2％降低到± 1％,铜和锌的阳极消耗分别从先前的13 kg/t、7。
4)hard copper plating电镀硬铜
1.However,compared with common acid bright copper plating,the available additives for acidhard copper plating are rather few,and the researches related to the factors affecting hardness of the coatings are even fewer.近年来,铁基圆筒电镀厚铜替代铜辊的电镀硬铜加工量随凹印制版产量的增加而急剧增长。
5)brass electroplating黄铜电镀
6)copper brushing plating电刷镀铜
延伸阅读
电镀铜分子式：CAS号：性质：使用最广泛的一种预镀层。锡焊件、铅锡合金、锌压铸件在镀镍、金、银之前都要镀铜，用于改善镀层结合力。铜镀层是重要的防护装饰性镀层铜/镍/铬体系的组成部分，柔韧而孔隙率低的铜镀层，对于提高镀层间的结合力和耐蚀性起重要作用。铜镀层还用于局部的防渗碳、印制板孔金属化，并作为印刷辊的表面层。经化学处理后的彩色铜层，涂上有机膜，还可用于装饰。目前使用最多的镀铜溶液是氰化物镀液、硫酸盐镀液和焦磷酸盐镀液。
