电镀液,electroplating solution
1)electroplating solution电镀液
1.Purification process ofelectroplating solution for bubble nickel production;泡沫镍生产中电镀液净化工艺
2.The new method of continuously determinating copper and stannum inelectroplating solution;测定电镀液中铜、锡的新方法
3.first derivative spectrophotometric method for determining of micro samarium inelectroplating solution is given,using xylenol orange as color reagent.提出了利用二甲酚橙为显色剂测定电镀液中微量钞的一阶导数分光光度法。
英文短句/例句
1.Determination of Tungsten in Ni-W-P Alloy Electroplating SolutionNi-W-P合金电镀液中钨的测定
2.The Measurement of Content of Cr～(6+) and Cr～(3+) in the Electrochromiuming Solution by Double-Waveleanth Photometric Method;双波长分光光度法测定镀铬电镀液中Cr～（6+）和Cr～（3+）含量
3.A Study on Stability of Nano-ZrO_2 in Ni-based Electroplating bath;纳米ZrO_2在Ni基电镀液中悬浮稳定性的研究
4.Direct Determination of Hexavalent Chromium in Trivalent Chromium Plating Bath电镀三价铬镀液中Cr~(6+)的直接测定
5.Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
6.Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating .采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
7.Effects of NiSO_4 content in plating bath on the quality of Ni-W alloy coating镀液中硫酸镍浓度对镍钨合金镀层电镀质量的影响
8.Effect of Ni/Zn Ratio in Plating Solution on Zn-Ni Electroplating of Acidic Liquid镀液中镍锌含量比对酸性液电镀Zn-Ni合金的影响
9.Automatic Potential Titration Analysis on Bright Acid Electroplating Copper Bath自动电位滴定分析光亮酸性镀铜溶液
10.Study of hollow fiber renewal liquid membrane process used for treating nickel-containing electroplating wastewater中空纤维更新液膜处理含镍电镀废水
11.Treatment of cyanide-containing wastewater and waste residue from cyanide electroplating bath氰化电镀槽液和含氰废水、废渣的处理
12.Development of Electroless Nickel Plating Bath EN-600 for PCBs电路板化学镀镍液EN-600的研制
13.Study on Nickel Reclamation from the Spent Electroless Nickel Plating Bath by Electrolysis电解法回收化学镀镍废液中镍的研究
14.Development of Electroless Gold Plating Bath IG-600 for PCBs电路板化学镀金液IG-600的研制
15.Feasibility Study on Electrolysis Regeneration of Spent Electroless Nickel Plating Bath电解再生化学镀镍老化液可行性研究
16.The diamond wheel for grinding magnet shoe with low sagitta was manufactured by composite electroplating in Ni-Co alloy electrolyte.采用镍-钴合金镀液电镀出磨低拱高磁瓦的金刚石砂轮。
17.Study on Amorphous Iron-chromium Alloy Electrodepositing From Trivalent Chromium Bath;从三价铬镀液中电沉积非晶态铁铬合金镀层的研究
18.Investigations of Nucleation Mechanism in Initial Period for Direct Electroless Nickel-boron Plating on Magnesium Alloy and Electrochemical Properties of Plating Solution镁合金直接化学镀Ni-B初期成核机理及镀液电化学性能研究
相关短句/例句
electroplating bath电镀液
1.Research progress on tin-lead alloyelectroplating bath;锡铅合金电镀液研究进展
2.The FAAS method suitable to the determination of trace Pb2+ in chromiumelectroplating bath was then established making use of the separating and enriching capability of the phenolic modified humic acid resin to Pb2+ ions.以FAAS法为检测手段,对镀铬液中痕量铅进行分离富集,建立了电镀液中痕量铅的测定新方法,应用于实际样品的测定,结果满意。
3.The optimization ofelectroplating bath and technique has been reached,which enables the successful performance of diamond bits in drilling hard and compact rocks.探讨了在普通镀镍溶液中加入铵离子后,电镀液成分和电镀工艺条件对镀层性能的影响,得到了一种用于钻进坚硬致密弱研磨性岩层的优化配方及工艺条件,讨论了铵离子引起的络合作用。
3)Plating solution电镀液
1.ZF410 plating solution plus additives for low inner stress nickel electroplating process and ZF305 plating solution plus additives for neutral pure tin electroplating process were developed, and successfully used in the tri-layer terminal electrode technology for chip components.研制出了ZF410低应力镀镍、ZF305中性纯锡电镀液和添加剂,并在片式元件三层端电极上获得成功应用。
4)plating liquid电镀液
1.By changing conditions such as composition ofplating liquid,plating time,size of electric current density and so on,copper electrode is plated,instituting Cu-Zn batteries with zinc electrode.影响镀层的质量有多种因素,镀层的质量由其机械、物理和化学性能体现出来,分别通过改变电镀液的组成、电镀时间、电流密度大小等条件电镀铜电极,并与锌电极构成Cu-Zn原电池,采用对消法测定其电池电动势的实验值,与理论值相比较,以选择铜电极电镀的最佳条件。
5)electroplate liquid电镀液
1.Determination of fluoride and chloride inelectroplate liquid by ion chromatography;离子色谱法测定电镀液中F~-和Cl~-
2.The effects of the composition ofelectroplate liquid and techological parameters on composite deposite of Ni-P-Co/WC were analyzed,and the optimum composition and parameters were determined.分析了电镀液配方和工艺参数对Ni-P-Co/WC复合镀层的影响,确定了最优的电镀液配方和工艺条件。
6)deplating wastewater电镀退镀液
延伸阅读
电镀液分子式：CAS号：性质：电镀液通常包括：(主盐，提供电沉积金属的离子，它以络合离子形式或水化离子形式存在于不同的电镀液中；(2)导电盐，用于增加溶液的导电能力，从而扩大允许使用的电流密度范围；(3)络合剂；(4)缓冲剂；(5)其他添加剂，如整平剂、光亮剂、抗针孔剂，以及有助于阳极溶解的活化剂等。除主盐和导电盐外，并非所有电镀液都必须含有上述各种成分。
