SMT焊点,SMT solder joint
1)SMT solder jointSMT焊点
1.According to random theory, a random fatigue semi-empirical model ofSMT solder joint in random vibration condition is created.研究了SMT焊点在随机振动条件下引起的振动疲劳情况,给出了SMT焊点半经验随机振动疲劳寿命累积模型,并通过对某SMT电路板进行随机振动疲劳测试,验证了模型的正确性。
2.According random theory, a random fatigue semi - experimental model ofSMT solder joint in random vibration condition is created.研究了SMT焊点在随机振动条件下引起的振动疲劳情况,给出了SMT焊点半经验随机振动疲劳寿命累计模型,并通过对某SMT电路板进行随机振动疲劳测试,验证了模型的正确性。
英文短句/例句
1.Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;SMT焊点的可靠性研究及CBGA焊点有限元分析
2.Research on Reliability of SMT Solder Joint in Dynamic Tensile Load动态拉伸载荷下SMT焊点可靠性研究
3.Inspection Solder Quality Research of SMT Based on Machine Vision;基于机器视觉的SMT焊点质量检测的研究
4.Study on Automatic Optical Inspection System for SMT Solder Joints Based on Machine Vision基于机器视觉的SMT焊点自动光学检测系统研究
5.SMT Solder Joint 3D Reconstruction Technology Based on Shape from Shading基于SFS原理的SMT焊点表面三维重构技术研究
6.Study on ANN-based Expert-System Applied to SMT Solder Joint Quality Control基于神经网络的SMT焊点质量控制专家系统设计
7.Study on SMT Solder Joints Quality Inspection and Intelligent Discrimination Based on Solder Joint Virtual Evolving Technology;基于焊点虚拟成形技术的SMT焊点质量检测和智能鉴别技术研究
8.3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model基于改进光照模型由SFS方法重构SMT焊点三维形状技术
9.Research on the Theory & Experiments of SMT Lead-Free Solder Joint Reliability under Drop Impact;跌落碰撞下SMT无铅焊点可靠性理论与实验研究
10.An AOI algorithm for transistor lead-free solder joints of SMT post-reflowSMT炉后晶体管类元件无铅焊点的自动光学检测算法
11.ORS Over Reflow Soldering再流回焊接，SMT元件的焊接方式
12.Research on Simulation of Reflow Soldering Process of SMTSMT再流焊焊接工艺仿真技术探讨
13.The influence of SMT reflow soldering temperature curve on the welding qualitySMT再流焊温度曲线对焊接质量的影响
14.The Design and Development of the Electrical Control System for SMT Solder-reflow Machines;SMT回流焊设备电控系统的设计开发
15.Art Simulation Design Technology of Reflow Jointing Based on SMT基于SMT的再流焊工艺仿真设计技术
16.Summary of New Soldering Technology for SMT/THT Mixed Production新型SMT/THT混装焊接技术概述
17.Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?产品的温度曲线是否符合零件制造商提供的SMT零件回流焊要求?
18.The Improvement of the Solder Paste Performance and the Effect of Composition on It;SMT无铅焊锡膏性能的改进及其组份对性能的影响
相关短句/例句
SMT solder joint qualitySMT焊点质量
1.Based on analysed the test technology which is used in common in SMT solider joint assembly quality,the basic theory and method ofSMT solder joint quality automatic testing and intelligent detecting technology,which basing on SMT solder joint virtual evolving technology, are proposed and introduced.在分析SMT焊点组装质量常用检测技术的基础上 ,提出并介绍了基于SMT焊点虚拟成形技术的SMT焊点质量自动检测与智能鉴别技术的基本原理和方法 ,并对该技术的研究意义、主要研究内容和研究思路等问题进行了探
3)SMT lead-free solder jointSMT无铅焊点
4)SMT Solder Joint Virtual EvolvingSMT焊点虚拟成型
5)SMT laser re-fluid weldingSMT激光再流焊
6)spot welding gun点焊焊枪
延伸阅读
激光焊与氩弧焊的修模具的区别激光焊与握弧焊是常用的模具修复的两种方法。氩弧焊氩弧焊是电弧焊的一种，利用连续送进的焊丝与工件之间燃烧的电弧作热源，由焊炬喷嘴喷出的气体保护电弧来进行焊接的。目前氩弧焊是常用的方法，可适用于大部分主要金属，包括碳钢、合金钢。熔化极惰性气体保护焊适用于不锈钢、铝、镁、铜、钛、锆及镍合金，由于价格低，被广泛用于模具修复焊，但焊接热影响面积大、焊点大等缺点，目前在精密模具修补方面已逐步补激光焊所代替。激光焊激光焊是高能束焊的一种，激光焊是利用大功率相干单色光子流聚焦而成的激光束为热源进行的焊接。这种焊接方法通常有连续功率激光焊和脉冲功率激光焊。激光焊优点是不需要在真空中进行，缺点则是穿透力不如电子束焊强。激光焊时能进行精确的能量控制，因而可以实现精密器件的焊接。它能应用于很多金属，特别是能解决一些难焊金属及异种金属的焊接。目前已广范用于模具的修复。修复模具时的主要区别使用非消耗电极与保护气体，常用来焊接薄工件，但焊接速度较慢，且热输入比激光焊大很多，易产生变形，激光焊焊缝的特点是热影响区范围小，焊缝较窄,焊缝冷却速快、，焊缝金属性能变化小，焊缝较硬。精密模具的焊接不同于其他零件焊接，其对质量控制的要求非常严格，而且工件的修复周期必须越短越好。传统的氩焊发热影响区大，对焊接周边造成下塌，变形等几率非常高，对于精度要求高，焊接面积大的模具，必须经过加温预热，在特定温度下进行焊接，还要自然降温进行退火处理，如此折腾下来费用和时间都不能为用户所接受；而冷焊又存在焊接不牢固和脱落等缺陷。而激光焊没有氩焊和冷焊这些不足，因此逐渐被广泛应用。
