微焊点,microscale solder joints
1)microscale solder joints微焊点
1.Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cumicroscale solder joints热时效和焊点尺寸对SnAgCu微焊点强度的影响
英文短句/例句
1.Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints热时效和焊点尺寸对SnAgCu微焊点强度的影响
2.Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;微电子焊接助焊剂及其焊点组织研究
3.Effect of Stand-off Height on Microstructure and Tensile Strength of Solder Joints焊点高度对焊点微观组织和抗拉强度的影响
4.Electrodes Displacement Detection System in Resistance Spot Welding电阻点焊热膨胀电极位移微机检测系统
5.A Study on Microcontroller System and Its Reliability Design in Spot Welding;点焊微电脑控制系统研究及可靠性设计
6.Data Acquisition System Based on Microcontroller for Quality Information of Resistance Spot Welding;基于微控制器的电阻点焊质量信息采集系统
7.The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;微电子组装焊点可靠性及其铅污染问题的研究
8.Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component微电子组装表贴元件焊点三维形态预测
9.Microstructure and property of spot welded joint of ultra-high strength steel and micro-alloy steel超高强度钢与微合金钢点焊接头的组织与性能
10.SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING电子封装微互连焊点力学行为的尺寸效应
11.electrode ,metal contact, for welding machines电焊机金属接点焊条
12.According to operating conditions of arc welding machines and the meaning of duty cycle, the monitoring system of the welding machines duty cycle with MCU is studied.根据电弧焊的特点和焊机负载持续率对焊机使用的要求,研究了监控焊机负载持续率的微机系统。
13.The observed friction force is the force required to break these tiny welds.我们观察到的摩擦力，就是破坏这些细微的焊接点所需要的力。
14.Research on Effects of Minute Amount of Rare-earth Element Ce on Properties of SnAgCu Alloy and Reliability of Soldered Joints;微量稀土Ce对SnAgCu钎料合金性能的影响及焊点可靠性的研究
15.Experimental Research and Reliability Analysis on Lead-free Solder Joints in Microelectronic Packaging微电子封装中无铅焊点的实验研究与可靠性分析
16.Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为
17.The joint formed by welding.焊接点通过焊接形成的接合点
18.Locator Optimization for Resistance-spot-welding Fixtures电阻点焊焊装夹具定位点的优化设计
相关短句/例句
micro-resistance spot welding微型点焊
1.Effect of TiC coating on electrode tip surface on electrode degradation duringmicro-resistance spot welding;微型点焊时电极表面熔敷TiC涂层对电极失效的影响
2.The electrode degradation mechanism is studied duringmicro-resistance spot welding of nickel-plated steel to nickel sheet in the present paper.本文主要研究了微型点焊镀镍钢板和镍板时电极失效的机制。
3)Mirco Spot Weld微点焊
4)small-scale resistance spot welding微电阻点焊
1.Effects of surface roughness on joints properties insmall-scale resistance spot welding of beryllium copper;表面粗糙度对铍青铜微电阻点焊接头性能的影响
5)microelectronic solder joint微电子焊点
6)micro spot-welder微型点焊机
延伸阅读
点焊胶粘剂分子式：分子量：CAS号：性质：用于胶接点焊工艺胶粘剂。用环氧树脂、聚硫橡胶等配合制成。具有联接强度高、密封性好、应力分布均匀、耐疲劳性好、结构重量轻、可以进行阳极氧化、生产率高等优点。可用于铝、铝合金等金属材料和玻璃钢的胶接点焊，也可用于金属材料的结构粘合和灌封等。
