QFP焊点,QFP solder joint
1)QFP solder jointQFP焊点
1.Three kinds of SnPb solders with different ratios of Pb and two lead-free solders are assessed by Finite Element numerical simulation method in the plastic strain ofQFP solder joint,calculating the different behaviors of plastic strain caused by solder\"s different parameters in our model of ΔPS≈-2.7),定量评估QFP焊点的塑性应变。
英文短句/例句
1.Research on the Reliability of Soldered Joints and Optimum Simulation for QFP Gull Wing Lead Sizes;QFP焊点可靠性及其翼形引线尺寸的优化模拟
2.electrode ,metal contact, for welding machines电焊机金属接点焊条
3.Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;微电子焊接助焊剂及其焊点组织研究
4.Rework of QFP Applied to Aerospace Products航天产品新型QFP器件高可靠性返修
5.The joint formed by welding.焊接点通过焊接形成的接合点
6.Locator Optimization for Resistance-spot-welding Fixtures电阻点焊焊装夹具定位点的优化设计
7.monoside twin shots welder(KD-16)单面双点点焊机（KD-16）
8.monoside twin shots welder(KD-17)单面双点点焊机（kd-17）
9.To solder(two pieces of metal)together using a hard solder with a high melting point.硬焊用高熔点的硬质焊锡将（两块金属）焊在一起
10.Application and Characteristic of Shielded Flux Cored Arc Down Welding Technology药芯焊丝自保护焊下向焊技术的特点及其应用
11.solder that contains copper; melts at a relatively high temperature; used for brazing.含铜的焊料，熔点较高，用于铜焊。
12.hydromatic welder水力导向焊条顺序夹持多点电焊机
13.Multi-spot Hot-bar Soldering Process Parameters Optimization多焊点Hot-bar锡焊工艺参数优化
14.Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model波峰焊焊点有限元模型的建立与分析
15.Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint回流焊对SnAgCu焊点IMC及剪切强度的影响
16.Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages焊盘尺寸对FC-PBGA焊点可靠性的影响
17.Discussion on advantage of resistance spot welding using servo gun and MFDC伺服焊枪中频直流电阻点焊优势探讨
18.Research of locating bonding points automatically in chip bonding芯片焊接中焊点自动定位技术的研究
相关短句/例句
quad flat packge devicesQFP器件
3)spot welding gun点焊焊枪
4)point electrode点焊焊条
5)spot welding点焊
1.Phase reconstruction and chaotic properties analysis of signal time series of electrode displacement during Al-alloysspot welding;铝合金点焊电极位移时序相空间重构及混沌特征分析
2.Nucleation mechanism ofspot welding galvanized steel sheet;镀锌钢板点焊形核机理的研究
3.Analysis on thespot welding parameter and welding structure of magnesium alloy;镁合金点焊工艺及焊缝组织分析
6)solder joint焊点
1.Effect of voids on the reliability of EBGAsolder joints under thermal cycle;热循环加载条件下空洞对EBGA焊点可靠性的影响
2.Effect of temperature cycling stress profile on the thermal fatigue life ofsolder joints of QFP;温度循环应力剖面对QFP焊点热疲劳寿命的影响
3.Shape prediction and reliability analysis of QFPsolder joint;QFP焊点形态预测及可靠性分析
延伸阅读
[styrene-(2-vinylpyridine)copolymer]分子式：分子量：CAS号：性质：学名苯乙烯-2-乙烯吡啶共聚物。微黄色粉末或透明小颗粒晶体。无臭，无味。不溶于水，溶于酸、乙醇、丙酮、氯仿。有抗水、防潮性能，适用于多种药片的包衣等。
