灌胶工艺,glue feed
1)glue feed灌胶工艺
1.Taking the installation of lathe bed and vertical shaft of computer numerical control machine as a example, a newglue feed technology was introduced, which is a promising method compared to traditional technique.以立式数控加工中心的床身与立柱的安装为例,介绍了灌胶工艺新技术;与传统工艺比较,灌胶工艺技术是值得推广的先进方法。
2)grouting technology灌浆工艺
1.Chemicalgrouting technology for TGP s permanent shiplocks;三峡永久船闸化学灌浆工艺
2.The vacuumgrouting technology used for construction of prestressed concrete bridges is presented.介绍预应力混凝土结构施工中的真空灌浆工艺施工工法,提出确保真空灌浆工艺顺利实施的控制要点。
英文短句/例句
1.TECHNOLOGY OF PRESSURE GROUTING UNDER PILE TIP AT COBBLE LAYER桩端压力灌浆工艺在卵石层灌注桩中的应用
2.The crack grouting diffusion radius is the basic gist of the grouting construction design and grouting craftwork control.灌浆扩散半径是进行灌浆结构设计和灌浆工艺流程控制的基本依据。
3.Curtain Grouting Technology of Special Dam Section in Taoyuan Hydro-junction of Tonghua通化桃园水利枢纽工程特殊坝段帷幕灌浆工艺技术
4.Application Study of Grouting Technology for Prestressed Duct Based on High Performance Material基于高性能材料的预应力孔道灌浆工艺应用研究
5.Study of high performance epoxy gap-filling and application process高强环氧灌浆料及其施工工艺的研究
6.The application of the post grouting technology of bored concrete pile in Taiyuan region灌注桩后压浆工艺在太原地区的应用
7.The Application of Extruded-expanded Mud-jacking Technique on the Bottom of the Filling Pile灌注桩桩底挤扩压浆处理工艺及应用
parison and Analysis of Methods and Effect of Curtain Grouting Rock Foundation of Existing Soil Dam既有土坝坝基帷幕灌浆施工工艺及灌浆效果的探讨
9.On construction craft of danger control and reinforcement curtain grouting project in some reservoir dam某水库大坝除险加固帷幕灌浆工程施工工艺
10.POST GROUTING PILES TECHNIQUE(2)--TECHINQUE OF PRESSURE GROUTING AT BASE OF SLURRY-DRILLED PILES后注浆桩技术(2)——泥浆护壁钻孔灌注桩桩端压力注浆工艺
11.Post pressure grouting of borehole cast-in-situ pile bottom and its quality control钻孔灌注桩孔底后压浆施工工艺及质量控制
12.Constructing Techniques and Experimental Study in Situ of the Cast-in-Situ Piles with Expanded-Base and Post-Pressure Grouting;扩底后注浆灌注桩施工工艺及其试验研究
13.Test and Application of Pipe Guiding Method of the Consolidation Grouting of Contact Section接触段固结灌浆引管法施工工艺试验及应用
14.Research on Construction Technique and Working Mechanism of Bored Pile by Base Post-Grouting;钻孔灌注桩桩桩端后压浆工艺与机理研究
15.Impact of Post Grouting Process of Pile Bottom on Bored Pile Bearing Behavior桩端后注浆工艺对钻孔灌注桩承载性状的影响
16.TECHNOLOGY OF POST-GROUTING PILES(3) --THE CONSTRUCTION TECHNIQUE OF GROUTING AT TIP OF AUGER-DRILLED PILES IN A DRY CONDITIONS后注浆桩技术(3)——干作业钻孔灌注桩桩端压力注浆工艺
17.Mechanism and Application of Post Grouting for Bored Pile in Slurry Wall浅析泥浆护壁钻孔灌注桩后注浆工艺的机理与应用
18.It is characteristics of poor groutability, difficult construction, rising cost and poor quality to grout under the condition of bearing pressure water.本文以挑园水库消力池集水井灌浆为例,对承压水条件下进行了灌浆施工工艺的试验研究。
相关短句/例句
grouting technology灌浆工艺
1.Chemicalgrouting technology for TGP s permanent shiplocks;三峡永久船闸化学灌浆工艺
2.The vacuumgrouting technology used for construction of prestressed concrete bridges is presented.介绍预应力混凝土结构施工中的真空灌浆工艺施工工法,提出确保真空灌浆工艺顺利实施的控制要点。
3)Embedding technology灌封工艺
1.The design of embedding,the selection of embedding material and the embedding technology process are separately described by analyzing the embedding technology for some HV(High Voltage) assembly(comprising power supply assembly,filament assembly and pulse modulator) in airborne SAR transmitter.通过对灌封工艺技术在机载雷达发射机高压组件(包括电源组件、灯丝组件以及脉冲调制器)上的应用,介绍了雷达发射机高压组件的灌封工艺设计思路,并从材料优选及工艺流程等方面分别进行了叙述,多次试验证明,该硅橡胶灌封材料及灌封工艺满足产品的设计要求。
4)grouting process灌浆工艺
1.A newgrouting process is studied which adding small amount of surfactant and coupling agent into water to make a new water emulsion used for improving the underwater concrete surface and adopting fast setting modified vinyl ester resin slurry or epoxy furfuralacetone with underwater curing agent to prepare grouting material.研究一种新的灌浆工艺,在水中加入少量的表面活性剂与偶联剂制成可以用于改善水下混凝土表面的水乳液,采用可快速固化的改性乙烯基酯树脂浆材,或环氧糠叉丙酮与水下固化剂配制成灌浆材料。
5)crack filling program灌缝工艺
6)bonding technology胶接工艺
ponents qualities ofbonding technology are influenced by many factors, which are complicated.胶接工艺中构件质量受多种因素的影响,内容比较复杂。
延伸阅读
灌封胶分子式：CAS号：性质：又称灌注胶。用于电子元件灌注密封的胶黏剂。主要有环氧树脂胶黏剂、室温硫化硅橡胶胶黏剂及有机硅凝胶等。使用时，将电子元件置于壳体或模型内，立即注入灌封胶，使整个元件浸没，待交联固化后不再取下壳体或卸下模具。多用于绝缘性能要求较高的电子元件的绝缘密封。
