键合机理,bonding mechanism
1)bonding mechanism键合机理
1.Thebonding mechanism is discussed.通过键合温度220~250℃、键合电压400~600 V的硅玻璃低温阳极键合实验,分析了温度和电场分别对键合强度和键合效率的影响,并讨论了键合机理。
英文短句/例句
1.Study on Transmission Laser Bonding and Its Parallel Micro Manipulation;激光穿透键合机理及其并联微操作平台的研究
2.Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS PackagingMEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
3.Investigation on the Mechanism and Microstructure and Mechanical Properties of the Anodic Bonding for the Pyrex Glass to Metals;Pyrex玻璃与金属阳极键合机理及界面结构和力学性能的分析
4.Simulation and Experiments Research on the Ultrasonic Bonding Mechanism of Microfluidic Chips;塑料微流控芯片超声波键合机理的仿真与实验研究
5.Microstructure and mechanisms of the interface between borosilicate glass and silicon by anodic bonding硼硅玻璃与硅阳极键合机理及其界面微观结构分析
6.Reason3: A slide phone with a broad keypad that fits well with your hand.理由3：手机为滑盖式，键盘宽大，非常适合你的手。
7.Reasonable cavity shape of crusher guarantees effective operation of crusher.合理的破碎腔形是保证破碎机有效工作的关键。
8.The Structure and Bonding Linkage Mechanism of the Calcium Silicate Hydrates Contained the Organic Complex Molecule;掺杂有机大分子水化硅酸钙的结构及键合原理
9.Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;超声键合界面微结构生成机理与规律研究
10.A stroke of a key, as on a word processor.按键（如在文字处理机上）按一下键
11.Selection and configuration of construction machineries was the key to optimize machinery combination and realize mechanization of efficient construction.机械设备的选型和匹配是优化机械设备合理组合、实现机械化高效施工的关键。
12.Molecular Simulation on Mechanism of Bonding Agents in HTPB Solid Propellant Model丁羟推进剂模型体系中键合剂作用机理的分子模拟研究
13.glucosidic linkage糖苷键[合],苷键[合]
14.The Design and Development of LF-loader of LED Die-bonder;LED键合机上料机构的设计与开发
15.A Theoretical Study on Nuclear Spin-Spin Coupling Constants of C-X (X=H,C) BondsC-H键和C-C键核自旋偶合常数的理论研究
16.A set of keys, as on a computer terminal, word processor, typewriter, or piano键盘一系列键，如计算机终端设备、文字处理机、打字机或钢琴上
17.The feeder mechanism of a die bonder and its virtual prototype芯片键合机传送机构及其虚拟样机研究
18.An organic compound containing many double bonds.多烯一种包含许多双键的有机化合物
相关短句/例句
geopolymerization mechanism键合反应机理
1.The material structure andgeopolymerization mechanism of the products were investigated using X-ray diffraction(XRD),Fourier transform infrared(FTIR) spectroscopy,and()~(29)Si and()~(27)Al ma.据此,对键合反应机理模型进行了推测。
3)bonder[英]["b?nd?][美]["bɑnd?]键合机
1.Design of the Control System for an XYZ Table Used in Wire Bonders;键合机三维工作台控制系统的设计
2.A design ofbonder motion control system was proposed based on DSP+FPGA,has realized the high speed and high precision control to the movement of line motor in the bonding platform.提出了一种基于DSP+FPGA的键合机运动控制系统设计方案,实现了对键合机平台中直线电机的高速高精运动控制。
4)Wire Bonder键合机
1.Fundamental Principles and Methods of Ultrasonic Control inWire Bonder;键合机中超声波的基本控制原理及方法
2.Stack Loader/Unloader Design of Automatic LEDWire Bonder Based on Packaging Product Line;LED键合机上下料机构设计
3.For satisfying the requirement of the high speed and precision table in the chip packaging application, a high speed wire bonder precision positioning table was designed.面对芯片封装领域对高速、高精度平台的需求,设计了一种高速键合机精密工作台。
5)SB6 Substrate BonderSB6键合机
6)LED Die BonderLED键合机
1.Design and Research ofLED Die Bonder Feeder Mechanism Based on Virtual Prototyping Technology;基于虚拟样机技术LED键合机传送机构的设计与研究
延伸阅读
缔合机理分子式：CAS号：性质：缔合机理 association mechanism 简称A机理(A mechanism)。在配位化合物MLnX被Y取代反应中，Y接近MInX，先于X的离去。反应速率决定步骤有中间体生成，具有比原来配位化合物高的配位数。新键的生成是反应速率的决定步骤。例如，反应[Pt(NH3)3Cl]++Br-[Pt(NH3)3Br]++Cl-其反应速率可表示为V=kc[Pt(NH3)3Cl+)c(Br-)。反应速率与配位化合物浓度c(Pt(NH3)2Cl+)及外来配体浓度c[Br-]均有关。其特点是双分子的二级反应。
