塑封,molding
1)molding[英]["m?uldi?][美]["mold??]塑封
1.From the points of view of lead frame design, processing accuracy control, inner packaging material choosing, desired inner packaging shape control, the realizing ofmolding air-tightness and the perfection of environmental condition, the article discussed the design and process key points on raising the isolation voltage to develop world advanced-level product and to form volume pr.介绍了研制出其性能达国际先进公司同类产品水平的塑封双列直插式光耦合器的工作原理和提高绝缘耐压的技术难点 ,从引线框架设计、加工精度控制、内包封材料选型、理想内包封形状控制、塑封气密性的实现、环境条件的完善等方面讨论了提高绝缘耐压的设计和工艺要
2.In this thesis,molding process for a typical TSOP product is studied in detail, and FEA(Finite element analysis) has been applied in this process.本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。
3.Also the way to solve the issue of package-chipping,such as improving the structure ofmolding tooling design,lead frame,the direction of D/T(Such as inverted punch and body supporting) ,promoting the characteristic of the compound andmolding tooling will be shared.本文展现了崩角的几种现象,对出现的原因进行了分析,并提出了通过改善模具的凸凹模结构、改善框架冲切方向(反冲、胶体支撑)、优化塑封料特性、改进塑封模具等都可不同程度的改善崩角。
英文短句/例句
1.plastic sealed micro-wave low noise diode塑封低噪声微波二极管
2.Analysis on the Relation between EMC Property and Packaging Defect浅析环氧塑封料性能与器件封装缺陷
3.The Analysis and Research of Transfer Molding Technology in Micro-electronics Plastics Packages;微电子塑封传递模塑成型技术的分析与研究
4.Dimensional tolerances stipulation of plastic packaging mouldGB/T14664-1993塑封模具尺寸公差规定
5.automatic plastic bag film seaming and cutting machine塑料薄膜袋自动封剪机
6.ties for sealing plastic bags封塑料袋用的捆扎条.
7.plastic film continuous sealing machine塑料薄膜连续封口机
8.A sealed plastic or foil container used in packaging frozen or dehydrated food.塑胶封袋用来装冰冻或蒸干食物的密封的塑料或箔制容器
9.Study on preparation of polyurethane-terminated for low temperature plastify type PVC plastisol低温塑化型PVC塑溶胶用封端聚氨酯的研制
10.These plastic packs of food are hermetically sealed.这些塑胶包的食物是严密地封住。
11.closed cell elastomeric insulation密封微孔泡沫橡塑隔热材料
12.Sealing strips for plastic doors and windowsGB/T12002-1989塑料门窗用密封条
13.The pit cover should be sealed over with tar paper or plastic.顶盖必须用焦油纸或塑料封闭。
14.REPLACE PLASTIC 2-4 ACCUMULATOR AND SEALS WITH ALUMINUM.用铝替换塑料的２－４贮集器和封
15.The dictionary is protected by a jacket of clear plastic.词典带有一个透明塑料的护封。
16.The FEA Simulation of Moisture Diffusion in Electronic Packages;塑料电子封装件中湿扩散有限元分析
17.A method to improve seal property by plastic deformation;一种用塑性变形改善密封性能的方法
18.The machine is suitable for compounding plastic double edge sealing, form of medium sealing, cut-off and sealing into a bag.该机适用于复合塑料双边封、封的成形、合与切断成袋。
相关短句/例句
plastic package塑封
1.Development of the automatic loader system forplastic package of integrated circuit;集成电路塑封自动上料系统的研制
2.Study on autolead frame load technology forplastic package of integrated circuit;集成电路塑封自动上片技术的研究
3)plastic package die塑封模
1.Design ofplastic package die with multi-injection head for integrated circuit;集成电路多注射头塑封模设计
2.The difference between ball grid array(BGA) and conventionalplastic package die for integrated circuit product was analyzed.分析了BGA塑封模与传统集成电路产品塑封模的不同点,通过对BGA封装难点的分析,提出了BGA产品封装过程中出现的基板溢料问题的解决方案,并详细介绍了BGA塑封模溢料控制机构和具体实施方法。
4)encapsulating mould塑封模
1.The theory for design of the air-blow of theencapsulating mould is introduced.介绍了塑封模气浮设计的原理 ,应用材料力学原理对塑封模气浮不良现象进行了分析 ,为塑封模的设计提供了理论依
5)molding compounds塑封料
1.Traditional epoxymolding compounds are facing great challenges for both of the voice from ever-rising environmental protection and the needs of improving property of electronic encapsulating materials for integrated circuit industry.随着全球环境保护呼声的日益高涨以及集成电路工业对于电子封装材料性能要求的不断提高,传统的环氧树脂塑封料(EpoxyMoldingCompounds,EMC)正在面临着巨大的挑战。
6)encapsulating molding塑封模具
1.Analysis of the force ofencapsulating molding;塑封模具设计中力的分析与计算
延伸阅读
环氧塑料封装产品环氧塑料封装产品翻坛刁 获魏簇蕊}产吧竺i环‘塑\
