大功率电子芯片,High temperature electronics
1)High temperature electronics大功率电子芯片
2)power chip功率芯片
1.In this paper, the welding technology of micro-wave GaAspower chip was investigated deeply with 80Au20Sn.文章选用80Au20Sn焊料对微波GaAs功率芯片的焊接技术进行了较为系统深入的研究,通过对共晶焊接设备与真空烧结设备分别对焊接时气体保护、焊片大小、真空工艺过程的施加和夹具设计等因素进行了试验分析。
英文短句/例句
1.Effects of Voids on Thermal Reliability in Power Chip Die Attachment Solder Layer空洞对功率芯片粘贴焊层热可靠性影响的分析
2.Electrical system measuring and controlling instrument based on AT73C500 chipset基于AT73C500芯片的无功功率补偿测控仪
3.Design of a Constant-current Control Chip for Driving High-power White LED;大功率照明LED恒流驱动芯片的研制
4.Two IC for DC Motor Driving and Their Applications;两款直流电机功率驱动芯片及其应用
5.Design of a High-power LED Drive Chip Based on CMOS Technology一款CMOS大功率LED驱动芯片的设计
6.A Power Amplifier Design for UHF RFID Reader ChipUHF RFID阅读器芯片功率放大器设计
7.Foundational Technology of Energy-Saving & Emission Reduction--Power Semiconductor Devices and IC"s节能减排的基础技术-功率半导体芯片
8.Integrated circuit design for solar cell maximum power point tracking光伏电池最大功率点跟踪芯片的设计
9.Design of Constant-current Driver IC for Power White LEDs大功率照明白光LED恒流驱动芯片设计
10.Methods Discussion on How to Improve Final Test Yield of Power MCM提高功率多芯片模块终测成品率的方法探讨
11.Study of Electric Ray Annealing on High Power Transistor Chip低频大功率晶体管芯片的电子束退火研究
12.Design and IC Implementation of High Efficiency and Low Power DC-DC Converter;高效率、低功耗直流电压转换器芯片设计与实现
13.Research on Power Factor Correction Technology and Its Controller Chip Design;功率因数校正技术研究及校正控制芯片设计
14.Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;功率载荷下叠层芯片尺寸封装热应力分析
15.The Study of Bottom-up Functional Verification Approach Driven by Coverage of Garfield;覆盖率驱动的Garfield芯片Bottom-up功能验证方案的研究
16.The Design of Filter Free Class D Audio Power Amplifier with PWM Modulation;PWM型免滤波D类音频功率放大器芯片的设计
17.Design of Low Power PFC Chip Circuits Without Multiplier;一种无乘法器的小功率PFC芯片电路设计
18.The Study of Power-Factor Monitoring and Compensation Based on Chip CS5460A;基于CS5460A芯片的功率因数监测与补偿的研究
相关短句/例句
power chip功率芯片
1.In this paper, the welding technology of micro-wave GaAspower chip was investigated deeply with 80Au20Sn.文章选用80Au20Sn焊料对微波GaAs功率芯片的焊接技术进行了较为系统深入的研究,通过对共晶焊接设备与真空烧结设备分别对焊接时气体保护、焊片大小、真空工艺过程的施加和夹具设计等因素进行了试验分析。
3)audio power amplifier音频功率放大器芯片
1.Chips with gain rectification foraudio power amplifiers;一种带增益修正的音频功率放大器芯片
4)power bare die功率裸芯片
1.The traditional methods for power transistor can t apply topower bare die due to various reasons such as high temperature and high operating currents.由于存在高温度、大电流等问题,传统的测试与老化筛选功率管的方法不能完全适用于功率裸芯片。
2.Thepower bare die has applied widely in power modules of electronic system such as automobile and domestic electronic appliances and so on.功率裸芯片广泛应用于汽车电子、家电等电子系统的功率模块,确保所使用的裸芯片具有高度的可靠性是提高产品成品率的关键。
5)high-power electronics大功率电力电子
1.The real-time simulation methods in the field ofhigh-power electronics were introduced and summarized.介绍了目前大功率电力电子装置的主要实时仿真手段,从复杂电力电子系统建模、实时交互仿真计算精度控制和复杂电力电子系统并行计算技术等几方面,对大功率电力电子实时数字仿真技术的研究现状及其发展方向进行了综述和讨论。
6)electronic chips电子芯片
1.Experimental study on heat sinks ofelectronic chips based on piezo actuator;基于压电驱动的电子芯片散热器试验研究
延伸阅读
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