陶瓷-金属封接,Ceramic to metal seal
1)Ceramic to metal seal陶瓷-金属封接
英文短句/例句
1.The Second Metallizing Process of Ceramic to Metal Seal陶瓷-金属封接中的二次金属化工艺
2.The Ceramic-to-Metal Seal Production Technology and Gas Media陶瓷-金属封接生产技术与气体介质——降低封接成本的一种有效方法
3.The status and importance of the quality and reliability of ceramic-to-metal seal in China are over viewed in this paper.综述了我国陶瓷-金属封接质量以及可靠性的现状和重要性。
4.Active Alloy Brazing Al_2O_3 Ceraics and Metal;氧化铝陶瓷与金属活性封接技术研究
parison of residual stress formed in tubular ceramics/metal jointing process管状陶瓷金属封接残余应力计算比较
6.Study on Antibullet Performance of Metal-ceramic Composite Armor金属封装陶瓷复合装甲抗弹性能研究
7.Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-TiAg-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金
8.Study on the Heat Resistant Adhesives for Bonding Metals to Ceramics;粘接金属与陶瓷的耐高温胶粘剂研究
bustion Reaction Welding of TiB_2 Ceramics and Metals;TiB_2陶瓷与金属的SHS反应焊接
10.The generator represents magnetron, packaged with constant magnets in ceramic-metal execution.该磁控管采用金属陶瓷封装，装有永磁体。
11.The generator represents magnetron, packaged with constants and electromagnets(2 coils magnetic) in the magnetic-shielded ceramic-metal execution.该磁控管的设计采用电磁石，封装采用金属陶瓷。
12.metal joint for conical flange pipe of acid proof potteries for chemical industry化学工业用耐酸陶瓷–圆锥法兰管金属接头
13.Designe Optimization of Ceramic-Metal Complex Structure Internal Grinding Spindle陶瓷—金属复合结构内圆磨接杆优化设计
14.A Method of Improving Brazing Joint Strength of Plated Ceramic to Metal提高复合电镀陶瓷与金属钎焊接头强度的方法
15.Research on Hybrid Ceramic-Metallic Internal Grinding Wheel Spindle陶瓷-金属复合结构内圆磨砂轮接杆的研究
16.Insulation Structure for a High Current Diode by Ceramic-metal Welding基于陶瓷-金属焊接的强流二极管绝缘结构设计
17.iron magnesium oxide cermet铁-氧化镁金属陶瓷
18.cermet electrodeposited coating陶瓷金属电沉积涂层
相关短句/例句
ceramic–metal seals陶瓷–金属封接
1.The technology ofceramic–metal seals,ceramic–metal seal structure and mechanisms of ceramic first metallization by the molybdenum–manganese(Mo–Mn) method are introduced.介绍了钼–锰(molybdenum–manganese,Mo–Mn)法陶瓷–金属封接工艺、陶瓷–金属封接结构、陶瓷一次金属化机理。
3)Ceramic to metal seal陶瓷金属封接
4)ceramic and metal jointing陶瓷与金属封接
5)ceramic/metal jointing陶瓷/金属封接
1.The residual stress is easily produced inceramic/metal jointing and it will affect the intensity of jointing and the reliability of products.陶瓷/金属封接过程中容易产生残余应力,将影响到封接强度和产品的可靠性。
6)metal of ceramic sealing金属陶瓷封接
延伸阅读
活性金属法陶瓷-金属封接分子式：CAS号：性质：将活性金属粉(如钛、锆、铪等)与，有机溶剂调合成膏状涂敷在要封接的陶瓷表面上。在涂有活性金属粉的陶瓷和金属零件之间放置能在较低温度下形成合金的金属焊料(如银、铜、镍、银-铜等)，在真空或惰性气氛中加热而使陶瓷-金属气密性封接的一种方法。活性金属对各种氧化物和硅酸盐均有较强的亲和力，可实现气密封接。以钛；银-铜法用得最为广泛。活性封接法的优点是工序少、周期短、瓷件不会变形，成品率高。但结构上对针封、套封较困难，也很难连续生产。
